Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices with 16 pcs fins 3.93''(L) x 3.93''(W) x 0.7''(H) /100mm(L) x 100mm(W) x 18mm(H)
*Made of high quality Aluminum, good thermal conductivity
*Reduce the risk of hardware failure due to overheating
*Maximize surface area Designed in contact with the cooling air. The 16 pcs fins increase the area of the board and thus provide for greater heat transfer
*Widely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
*Please make sure that the size of the heat sink fits that of your component
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices, where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
100% Brand New High Quality
Material: Aluminum Fins: 16 Size: 3.93"(L) x 3.93"(W) x 0.7"(H) /100mm (L)x 100mm(W) x 18mm(H) Quantity: 1 Weight: 123g (approx.) Used for : Various mini DC converter circuit board computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
1. Please check the specification table and make sure that the size of the heatsink fits that of your component. Thank You! 2. Please allow 1-3mm error due to manual measurement. Thanks for your understanding. 3. Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
Widely use for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.OFFERS BETTER AND FASTER HEAT DISSIPATING: This Aluminum Heat Sink is designed to reduce the risk of hardware failure due
