HY-880-10pcs(1PCS-1g)-CPU Thermal Paste Kit 5.15W/m- CPU Paste Thermal Compound Heatsink Paste Silicon Grease for PC CPU GPU LED PS4....

HY-880-10pcs(1PCS-1g)-CPU Thermal Paste Kit 5.15W/m- CPU Paste Thermal Compound Heatsink Paste Silicon Grease for PC CPU GPU LED PS4....

Brand: MoneyQiu
Product Code: MPM43608
Availability: In Stock

US$4.99

*Super carbon nano-grade super thermal conductive silicone grease/thermal paste, thermal conductivity5.15 W/m-k;Strong insulation performance, withstand voltage above 10,000 volts;

*The CPU Thermal Paste Low thermal resistance, keep the paste state for a long time;Wide operating temperature range, stable performance under -30℃-280℃ environment;High heat dissipation performance, cost-effective

*HY 880 Thermal Compound Better Than Liquid Metal : This thermal paste is composed of carbon particles and has extremely high thermal conductivity. It ensures that the heat generated by the CPU or GPU is effectively dissipated.

*Safety Application: Foriston thermal paste is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card.

*Warranty and Service: Our products are covered by the guarantee. If you have questions, please contact us in time. We will answer your questions promptly within 8 hours

Description

Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.Nano particle structureFine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity.StabilityA special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time.Non-conductiveThere is no concern about shorts due to non-conductivity.