HY-883-4g CPU Thermal Paste Kit-6.5 W/MK CPU Paste Thermal Compound Heatsink Paste Silicon Grease for PC CPU GPU LED PS4.

HY-883-4g CPU Thermal Paste Kit-6.5 W/MK CPU Paste Thermal Compound Heatsink Paste Silicon Grease for PC CPU GPU LED PS4.

Brand: MoneyQiu
Product Code: MPM43846
Availability: In Stock

US$2.49

- +

For Bulk Order, Get Better Price.

About this product

*Good thermal conductivity: super carbon nano-grade super thermal conductivity silicone grease, thermal conductivity of 6.5 W/m-k; each package is equipped with 1 spatula, 2 finger cots and 1 cleaning wipe. Make it very convenient for you to use

*Non-conductive; insulation performance; withstand voltage above 10,000 volts; low thermal resistance, long-lasting paste state; Wide operating temperature range, stable performance under -30℃-280℃ environment;

*Various size packaging specifications: HY883 cpu thermal paste has 3 packaging specifications (4g 10g 20g), which can meet the needs of different groups of people.

*HY883 Thermal Compound Paste Product applications: notebook and desktop computers; high-power LEDs; network communication equipment, household appliances, electronic components, etc.

*HY883 thermal paste has high durability; it will not compromise over time. After you apply, you do not need to apply again because it will last for several years.

Description

Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.Nano particle structureFine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity.StabilityA special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time.Non-conductiveThere is no concern about shorts due to non-conductivity.